Integrated Technology Lab is your preferred choice for turnkey contract manufacturing of Hybrid integrated circuits.
We help build our customer’s success by supplying premium quality thick film hybrid circuits at a low cost and on-time. With flexible manufacturing ITL can support single layer to multilayer hybrid circuit’s designs. Our cutting edge technology and lean manufacturing process can always meet customer design needs for hybrid circuitry
ITL specializes in short to medium length production runs. Our expertise is to act as an extension of our customer’s capabilities when there is a need to get new products to market quickly.
With more than 10,000 square feet of design and manufacturing space located in the domestic US. ITL has all the process and equipment capabilities for your requirements.
Supported Technologies
Manufacturing Process Types:
Thick-film printing
- Die Attach & Wire Bonding (AL & AU)
- Die Attach Wire Bond Integrity
- Surface mount (including through Hole)
Multi-chip modules
- Furnace, Seam Sealing And projection Welding
- Hermetic Integrity
Packaging
- Multi-layer Power
- LCC, Cerdip and Ceramic Side Braze
- Lead Frame, Flat pack